JPH0314061Y2 - - Google Patents

Info

Publication number
JPH0314061Y2
JPH0314061Y2 JP1981094177U JP9417781U JPH0314061Y2 JP H0314061 Y2 JPH0314061 Y2 JP H0314061Y2 JP 1981094177 U JP1981094177 U JP 1981094177U JP 9417781 U JP9417781 U JP 9417781U JP H0314061 Y2 JPH0314061 Y2 JP H0314061Y2
Authority
JP
Japan
Prior art keywords
board
carrier
positioning
base
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981094177U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58475U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9417781U priority Critical patent/JPS58475U/ja
Publication of JPS58475U publication Critical patent/JPS58475U/ja
Application granted granted Critical
Publication of JPH0314061Y2 publication Critical patent/JPH0314061Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP9417781U 1981-06-25 1981-06-25 基板位置決め用キヤリア Granted JPS58475U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9417781U JPS58475U (ja) 1981-06-25 1981-06-25 基板位置決め用キヤリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9417781U JPS58475U (ja) 1981-06-25 1981-06-25 基板位置決め用キヤリア

Publications (2)

Publication Number Publication Date
JPS58475U JPS58475U (ja) 1983-01-05
JPH0314061Y2 true JPH0314061Y2 (en]) 1991-03-28

Family

ID=29889111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9417781U Granted JPS58475U (ja) 1981-06-25 1981-06-25 基板位置決め用キヤリア

Country Status (1)

Country Link
JP (1) JPS58475U (en])

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS498166A (en]) * 1972-05-10 1974-01-24
JPS5723890Y2 (en]) * 1974-07-13 1982-05-24
FR2397125A1 (fr) * 1977-07-04 1979-02-02 Cii Honeywell Bull Procede et dispositif de positionnement d'elements, tels que des composants electriques ou electroniques, par rapport a un support

Also Published As

Publication number Publication date
JPS58475U (ja) 1983-01-05

Similar Documents

Publication Publication Date Title
EP3349550B1 (en) Fixing apparatus
JP2855719B2 (ja) 半導体装置
JPH0314061Y2 (en])
JPS5988900A (ja) 基板の位置決め装置
JPH04122093A (ja) ペーストの転写方法と転写治具
JP2534065Y2 (ja) ダイボンディング装置
JPS642478Y2 (en])
JPS58138100A (ja) チップ部品のテ−ピング方法及びその装置
JPS6068986A (ja) 印字ヘツド押圧機構
JPS588697Y2 (ja) 電子部品の保持テ−プ
JPS61255043A (ja) 電子部品装置
JPS6351244A (ja) マグネツト式テ−プフレ−ム位置決め装置
JPH088553Y2 (ja) Icソケット
JP2521488Y2 (ja) リードフォーミング装置
JPH1154907A (ja) プリント回路板のはんだ付け用治具とこのはんだ付け用治具を用いたプリント回路板の製造方法
JPS5914644A (ja) 半導体装置組立用リ−ドフレ−ム位置決め装置
JPS5979593A (ja) フレキシブル基板を用いた実装基板の製造方法
JPH06125197A (ja) 部品のマウント位置合わせ方法及び治具
JPH0344437B2 (en])
JPH043109B2 (en])
JPH10189791A (ja) マーク捺印装置および半導体装置のマーク方法
JPS62112294A (ja) 磁気バブルメモリデバイス
JPS60192444U (ja) 半導体デバイス組立装置の基板押え装置
JPH0419926A (ja) ラジアルテーピング電子部品の製造方法
JPS585343U (ja) リ−ドフレ−ム搬送位置決め機構